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MACIL

SERVICES
Electronic Manufacturing Services
The PCB assembly process for the manufacture of loaded printed circuit boards has been considerably simplified with our manufacturing facility. We offer full Turnkey manufacturing starting from Design support till Product building. Our PCB assembly and production processes are generally optimized to ensure very low levels of defects, and in this way produce the highest quality product. In view of the number of components and solder joints in today's products, and the very high demands placed on quality, the operation of this process is critical to the success of the products that are manufactured under MACIL controlled process.
Our PCB assembly process overview :
MACIL has various stages in the PCB assembly process including adding solder paste to the board, pick and place of the components, soldering, inspection and test. All these processes are monitored to ensure that product of the highest quality is produced. Our PCB assembly process described below assumes that surface mount components are being used as virtually all the PCB assembly these days uses surface mount technology.
  • Solder paste:

    Prior to the addition of the components to a board, solder paste needs to be added to those areas of the board where solder is required. Typically these areas are the component pads. This is achieved using a solder screen

    The solder paste is a paste of small grains of solder mixed with flux. This can be deposited into place in a process that is very similar to some printing processes.

    Using the solder screen, placed directly onto the board and registered in the correct position , a runner is moved across the screen squeezing a small mount of solder paste through the holes in the screen and onto the board. As the solder screen has been generated from the printed circuit board files, it has holes on the positions of the solder pads, and in this way solder is deposited only on the solder pads.

    The amount of solder that is deposited is controlled to ensure the resulting joints have the right amount of solder.
  • Automated Pick and place:

    We have a Hogh Speed Chip Shooter for Automated placement of SMT Components. During this part of the assembly process, the board with the added solder paste is then passed into the pick and place process. Here a High Speed Chip shooter is loaded with reels of components picks the components from the reels or other dispensers and places them onto the correct position on the board.

    The components placed onto the board are held in place by the tension of the solder paste. This is sufficient to keep them in place provided that the board is not jolted.

    In some assembly processes, the pick and place machines add small dots of glue to secure the components to the board. However this is normally done only if the board is to be wave soldered.

    The position and component information required to programme the pick and place machine is derived from the printed circuit board design information. This enables the pick and place programming to be considerably simplified.
  • Soldering:

    We have Reflow Soldering, Wave Soldering & Manual Soldering process. Once the components have been added to the board, the next stage of the assembly, production process is to pass it through the Wave soldering machine. Although some boards may be passed through a wave soldering machine, this process is not widely used for surface mount components these days. If wave soldering is used, then solder paste is not added to the board as the solder is provided by the wave soldering machine. Rather than using wave soldering, reflow soldering techniques are used more widely.
  • Inspection:

    After the boards have been passed through the soldering process they are often inspected.
  • Test:

    We have Full fledged Test lab to test electronic products which are being manufactured. Further you can find our list of Test equipments under Measurement Instruments section of this website
EMBEDDED SERVICES
FEATURES :
  • Micro Controller Based Software
  • Linux based BSP
  • FPGA-VHDL,Verilog,System C, BlueSpec
  • J2ME Applications
HARDWARE DESIGN SERVICES
FEATURES :
  • FPGA/CPLD Based Designs (Altera,Xilinx,etc).
  • Micro Controller Based Embedded Designs (Atmel,Philips,etc).
  • DSP based Designs (Freescale,TI etc).
  • SDH (STM-1/4/16/64) and PDH (E1/E2/E3/E4) based system Design for Telecom.
  • x86 and PPC based CPU Board Design.
  • ATCA Complaint Designs.
  • High Speed Bus based Back Planes-SP,LVDS,Telecom Bus,Utopia,etc.
  • Network Processor based Designs.
  • Optical Interface Designs.
  • Ethernet/RPR Switching based Designs-Broadcom,Zarlink,Marvel etc.
NETWORK DESIGN SERVICES
FEATURES :
  • Wide Area Network designs for ISPs - MPLS,VPN,VPLS,RPR,QnQ,VLAN.
  • Protocol Stack Design,Development,Analysis and Monitoring - OSPF,RIP,MP-BGP,LDP,PIM,SIM,VRRP,PPP,PPPoE,DHCP,TFTP,RADIUS,DIAMETER,IGMP.
  • Network Security - VPN,Firewalls,IPSec,Phising,Man in Middle Attack(For SSL),IP Spoofing,Intrusion/Extrusion Detection and Prevention.
  • Enterprise Security - Website Blocking (Content and URL) ,Attachment and Upload Filtering,Application Blocking(Chat,Messaging,PTP etc).
  • Enterprise Infrastructure - Mail,Web Hosting,Web Proxy,Caching,VPN,NATing and De-NATing,DHCP,VLAN.